As digitalization and connectivity continue transforming the rail and transport sectors, the need for reliable, robust, and ...

TDK Corporation has expanded its CGA series for automotive applications and C series for commercial multilayer ceramic ...

Infineon Technologies AG  introduces new isolated gate driver ICs for electric vehicles to enhance its EiceDRIVER family. The ...

ETSI has established a new Industry Specification Group (ISG) focused on Multiple Access Techniques (MAT) for 6G mobile ...

TDK Corporation has introduced two new high-voltage contactors designed for use in demanding applications. The HVC43MC integrates a mirror contact for position detection, while the HVC45 offers ...

Thermal challenges in 5G radios and the combination of passive and active thermal management techniques and hardware design ...

Formal verification leverages mathematical techniques such as model checking, theorem proving, and equivalence checking.

Learn about TEMPEST testing and how it protects telecommunications electronics from unauthorized access to sensitive ...

EMC connectors and cabling systems offer enhanced protection against EMI in military, aerospace, and industrial settings ...

The U.S. government launched the $280 billion CHIPS for America Act in 2022 to address these challenges. Beyond the CHIPS Act ...

Discover the rising trend of multi-die architectures in semiconductor designs and the engineering challenges they bring.

By going contrary to conventional thinking, a design team devised a more-efficient regulator device for the DC-power path.