SAP fixes serious security issues - here's how to stay safe

Security researchers SecurityBridge, who notified SAP after finding the flaw, described as a “missing input sanitation” ...
IEEE

Planar-bond-all: A technology for three-dimensional integration of multiple packaging functions into advanced power modules

Abstract: A packaging approach has been developed for fabrication of power electronics modules. The multi functions of power packaging are fulfilled through three-dimensional (3-D) planar electrical ...