Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
Morning Overview on MSN
China claims a monkey brain upload to a supercomputer
China’s latest neuromorphic project has pushed a once speculative idea into the realm of claimed reality: a monkey’s brain ...
Abstract: A brain-computer interface (BCI) system enables direct communication between the brain and external devices, offering significant potential for assistive technologies and advanced ...
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