Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...
Lam Research Corporation (NASDAQ:LRCX) is among the 11 Best Semiconductor Stocks with Huge Upside Potential. Lam Research Corporation (NASDAQ:LRCX) unveiled VECTOR® TEOS 3D, an entirely new deposition ...
- Technical innovation cuts production cycle time by up to six months<br></br>- First 3D-printed solar arrays will fly Spectrolab solar cells aboard small satellites built by Millennium Space ...
A team from UNIGE and INGV has represented in 3D, with unprecedented precision, the internal structure of an active volcanic system. An advance for risk management. Volcanic eruptions can have ...
EL SEGUNDO, Calif., Sept. 10, 2025 /PRNewswire/ -- Boeing (BA) [NYSE: BA] unveiled a 3D‑printed solar array substrate approach that compresses composite build times by up to six months on a typical ...
Mînzu, V. and Arama, I. (2025) A New Method to Predict the Mechanical Behavior for a Family of Composite Materials. Journal of Materials Science and Chemical Engineering, 13, 128-154. doi: ...
Mark Sammut grew up on the PlayStation 1 and has been playing games ever since, although he is no longer limited to just Sony consoles. Be it JRPGs, shooters, platformers, or hack and slash games, ...
Abstract: Various image datasets appear naturally in the form of multi-dimensional arrays (hypermatrices), called tensors. Image with incomplete entries, which often can be formulated as the low-rank ...
Abstract: Localizing a three-dimensional (3D) source using linear arrays (LAs) is a promising new localization technology. Existing solutions are either designed for specific LA deployments, are ...