IBM Granite 4.0 : Tiny AI Runs Offline, Slicing Costs for Real Workflows

Explore IBM’s open source Granite 4.0, a hybrid design with signed models and documented data for sensitive use in healthcare ...
Semiconductor Engineering

Chiplet Integration and Testing: Key Lessons for Next-Gen Semiconductor Packaging

How evolving standards, design-for-test strategies, and automation are shaping efficient production testing for 2.5D and 3D ...
EDN

Signal integrity and power integrity analysis in 3D IC design

The article explains the unique SI and PI challenges in 3D IC designs by contrasting them with traditional SoCs.
IEEE

Design and Implementation of AHB to APB Bridge and AHB to UART Communication for SoC Integration

Abstract: The AHB is a vital component in the AMBA family, deSigned to prioritize high performance, reduced power consumption, and efficient data transfer. Its main purpose is to facilitate ...