How plants decide their size: Study maps plant growth strategies across roots, leaves, and stems

What makes plants grow to a certain size? From the tiniest cells to whole leaves, roots, and stems, growth has to be ...
Seeking Alpha

Root plans increased R&D marketing spend and targets partnership channel expansion as new pricing model lifts LTVs

LaMalva forecasted "continued acceleration of policies in force growth" and announced plans to increase investment in direct R&D marketing by roughly $5 million in the fourth quarter. LaMalva ...
Morning Overview on MSN

Study maps how plants set size across roots leaves and stems

Unraveling the mysteries of plant growth, a recent study titled “How plants decide their size: Study maps plant growth ...
Hosted on MSN

Nextracker Inc. (NXT) Launches Earth Truss to Boost Solar Expansion in Australia

Nextracker Inc. (NASDAQ:NXT) is one of the best solar energy stocks to buy right now. On October 27, Nextracker Inc. (NASDAQ:NXT) introduced its NX Earth Truss foundation system in Australia, backed ...
villagenews

Social Security Administration announces new efforts to simplify SSI applications

WASHINGTON – The Social Security Administration has announced a large step in a multi-year effort to simplify processes for people who are applying for Supplemental Security Income (SSI) by starting ...
TMCnet

QNAP Launches 4U 60-Bay High-Density SAS/SATA JBOD, Delivering Petabyte-Scale Expansion for Enterprises

TAIPEI, Nov. 6, 2025 /PRNewswire/ -- QNAP ® Systems, Inc., a leading computing, networking and storage solution innovator, today launched the TL-R6020Sep-RP, a 4U 60-bay high-density SAS/SATA JBOD ...
ahajournals.org

Abstract 4365282: Predicting Aortic Diameter Expansion in Acute Uncomplicated Type B Aortic Dissection Using a Novel Voxel-Based Statistical Shape Modeling Approach

Background: Type B aortic dissection (TBAD) occurs when a tear develops in the intimal layer of the descending aorta. Aortic expansion remains a major factor limiting acuate uncomplicated TBAD ...
IEEE

Supression of TSV-Induced Stress by Using Negative Thermal Expansion Material

Abstract: TSV (Through Si via) -induced stress should be considered to reduce keep out zone (KOZ) generated in the three-dimensional integrated circuits (3D ICs). Stress relief methods such as ...