Abstract: The ability to map 3D forces is crucial in tactile sensors. However, most traditional sensors can generally only sense forces in one direction, that is, normal or shear stress. Here, we ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
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