Abstract: The rapid advancement of artificial intelligence applications is continuously increasing the demand for highperformance computing. Conventional interconnect technology based on micro bump ...
Abstract: This paper introduces an approach to panel level package (PLP) molding to meet the demand for an effective large-format packaging technology. For PLP molding, compression molding is an ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback