Spirit Electronics' precision ball grid array (BGA) reball process provides solder ball exchange with automated technology for high reliability solutions. The robotic ball removal process protects ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...

To reflow the surface mount components he picked up a cheap pancake griddle. The first thing [Jack] does is to heat up the board for about two minutes, then pluck off the FPGA and the FTDI chips ...

Tessera this morning announced an alternative to ubiquitous ball-grid technology that could significantly change both chip-scale packaging and more complex assemblies such as package-in-package ...

TT Electronics subsidiary IRC Inc. now offers a high-speed digital-termination ball-grid-array (BGA) package designed to prevent signal theft in consumer electronics devices. The CHC series ...