Challenges and Future Trends While the benefits of integrating advanced technologies and strategies are clear, challenges remain. The initial cost of technology adoption, the need for skilled ...

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New institute accelerates future of microelectronic system integration, advanced packaging Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.

Advanced packaging is rewriting the rules of the semiconductor industry. According to , in 2024, global AI data center ...

SEALSQ Corp announced the integration of its advanced Post-Quantum Cryptography (PQC) technology to enhance the security of electronic identities and documents through a collaboration with WISeID ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Boom Supersonic took another step Wednesday in putting its Greensboro production lineup into place by announcing Advanced Integration Technology as the tooling and automation provider for the ...

IRONSCALES, an AI-powered email security leader protecting 15,000 global customers from advanced phishing attacks, today announced a new integration with the ...

AI and HPC Fuel Advances in Packaging Technology 3DIC, FOPLP, and Chiplet Forums Gain Global Spotlight To drive global collaboration and next-gen system integration, SEMI will launch the 3DIC Advanced ...

New collaborative project to Advance Innovative Energy Storage Grid Integration includes the participation of the Dublin based institution EPRI Europe (Electric Power Research Institute).