From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.

EV Group, an Austria-based supplier of equipment and process solutions for semiconductors, showed the next-generation version ...

A $450 million bond issue for Wichita Public Schools has officially failed after Sedgwick County Commissioners certified election results Friday. The bond lost by a wafer-thin margin, with “No” votes ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...

G-ray struck upon a wafer-to-wafer direct covalent bonding approach that opened a broad range of applications covering a wide range of industries. The upshot is that G-ray is now positioned to ...

Silicon Connect chief executive officer (CEO) Chin Yoong Tatt said the partnership will see the development of a scalable ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the next-generation ...