Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
DUBLIN--(BUSINESS WIRE)--The "Ultrafiltration Market Size, Share, Trends, By Type, By Module, By Application, and By Region Forecast to 2030" report has been added to ResearchAndMarkets.com's offering ...
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