CAMBRIDGE, UK — Following up on the availability of Intel's Core-i7 Mobile quad-core processors, Suyin has launched a reversed pin grid array socket (rPGA-989) suitable for automatic assembly. The ...

Upgrading CPUs in office computers makes a great deal of sense given that while CPU technology has advanced greatly, other components live longer lives before they become obsolete. Upgrading poses a ...

The first image of AMD's upcoming Socket AM4, the new single platform for its Bristol Ridge and Zen CPU and APU products, has been leaked, revealing a pin-grid array (PGA) design with 1,331 pin ...

When AMD's Zen 4 processors arrive sometime next year, they're expected to use a new AM5 socket, replacing the AM4 socket used on the company's current best gaming CPU. This means the current best ...

The unparalleled pin density and low lead inductance of ball grid arrays (BGA) are essential in today’s high pin count, high frequency integrated circuits. However, that same pin density and unique ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...