Seeing is believing: imaging and visualization capabilities of the iTero Element 5D Imaging System are designed to enable better patient engagement and lead to increased patient acceptance of ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

In 2016, progress was made in data storage development as scientists at the University of Southampton successfully developed a 5D memory crystal capable of storing up to 360 terabytes (TB) of data, ...

The technology is what is known as five-dimensional (5)D optical storage and it is one the University of Southampton team has been pursuing for a while. It was first demonstrated back in 2013, with ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling ...

Broadcom has introduced its 3.5D eXtreme Dimension System in Package (3.5D XDSiP) platform for ultra-high-performance processors for AI and HPC workloads. The new platform relies on TSMC's CoWoS and ...

Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3.5D ...

When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. BURBANK, CALIF.– Cameron Pace Group debuted 5D technology at the 2013 Winter X Games, addressing ...

LAS VEGAS--(BUSINESS WIRE)--VeriSilicon (688521.SH) today announced that QDay Technology, an expert in GUI software development, has joined VeriSilicon’s watch graphical user interface (GUI) ecosystem ...

MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...