The design tools Foundry processes for through-silicon vias, temporary bonding and bump architecture The assembly process, such as what is first bonded to what The industry is at the point where the ...
Engineers in Germany have developed a new compact imaging system that’s capable of recording hyperspectral images in five dimensions. This 5D process means capturing data related to multiple ...
OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts ...
[EETimes] – Intel believes it can drive Moore’s Law down to 7 nanometers even without long-delayed advances in extreme ultraviolet lithography. It also gave its most detailed look to date at its ...
SEOUL, South Korea, July 09, 2024--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
Samsung Electronics is to provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to Preferred ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback